In a strategic partnership, Rittal and ZutaCore, a waterless, two-phase, liquid cooling company, have developed the first Rittal HPC Cooled-by-ZutaCore solutions. With this cooperation, Rittal is expanding its comprehensive range of IT solutions by innovative direct chip cooling for high power densities and hotspot situations.
As a result, customers will be able to obtain highly efficient, scalable cooling solutions for demanding cooling requirements - from edge, hyperscale and colocation through to high-performance computing (HPC) - from a single source.
By using an innovative direct-on-chip evaporative cooling technology, Rittal OCP racks are prepared to cool any existing or future processor that might be required, no matter what the power level, as computing continues to evolve.
Customers can use OCP racks from Rittal combined with the innovative direct-on-chip evaporative cooling solution from ZutaCore to meet and surpass the challenges posed by server-level hot spots and high-performance-computing requirements, consistently, in any climate.
This solution goes beyond the limits of air and eliminates the use of water, mitigating the risk of IT failure. Furthermore, two-phase liquid cooling is prepared for any evolution in high-powered chips: there is no limit to what it can cool as processor packages progress.
Read our brochure to find out more about the benefits of the OCP (Open Compute Project) rack and how the new Rittal HPC Cooled-by-ZutaCore direct chip cooling solution can help increase the efficiency of your data centre.
Our white paper on "High Performance Cooling" describes in detail the new cooling technology, which is based on an innovative direct-on-chip cooling process and thus opens up new efficiency potentials, especially in the upper performance range.
Would you like to learn more about the innovative Direct Chip Cooling solution?
Then visit our virtual booth at the OCP Virtual Summit and find out more about the innovative cooling solution developed by Rittal and ZutaCore.